Description
eSun ePLA-Matte With an excellent matte printed surface, eSUN Matte PLA has a better printing effect and no obvious layer lines compared to regular PLA. Not easy to break. Its support structure is easy to peel off. High Toughness and Better Adhesion Compared with ordinary PLA filament, eSUN Matte PLA has higher toughness. Printed models are not easy to break or crack, and can be widely used in accessories, home decoration, toys, sculptures, shells, and COSPLAY. With the upgraded paper spool, eSUN Matte PLA has better adhesion and printability which improves the problem of bottom adhesion on the plate. Stable Dimensional Tolerance Minimum tolerance and low warping to ensure consistent feeding and stable prints, good layer adhesion, less stringing, no bubbles, easy handling, resulting in an outstanding surface finish and high precision. 1kg tangle-free and non-clogging filament spool, perfect roundness and very tight diameter tolerance, good winding, no overlapping or tangling. Melts well, feeds smoothly and consistently without clogging the nozzle or extruder, high successful print rate. Eco-friendly Packaging and Spool scraps are reused to produce recyclable spools and packaging boxes. eSUN filament comes in a sealed vacuum bag with a desiccant bag, easily keep your 3D printer filaments in optimal storage conditions and free of dust or dirt before opening the sealed vacuum package. With an excellent matte printed surface, eSUN Matte PLA has a better printing effect and no obvious layer lines compared to regular PLA. Not easy to break. Its support structure is easy to peel off. Key Features High Toughness and Better Adhesion Stable Dimensional Tolerance Tangle-Free and Non-Clogging Eco-Friendly Packaging and Spool
Features
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Manufacturer: eSUN
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Model: ePLA-Matte-P175DB1
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EAN: 6922572201798
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Weight: 1440 g
Buy eSUN PLA -Matte on STRATO3D with fast shipping in Italy.
Note: In case of discrepancy between the variant description and the product code (SKU), the product code takes precedence for ordering purposes.
